MICROELECTRONICS RELIABILITY
SCI一区
EI同步收录
月刊
高认可度
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期刊基础介绍
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
期刊核心参数
通讯方式
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
涉及的研究方向
工程技术-工程:电子与电气
出版国家或地区
ENGLAND
出版语言
English
年文章数
176
PubMed Central (PMC)链接
平均录用比例
容易
CITESCORE
CiteScore SJR SNIP CiteScore排名 4.10 0.436 0.932 学科 分区 排名 百分位 大类:Engineering 小类:Safety, Risk, Reliability and Quality Q2 78 / 235 67% 大类:Engineering 小类:Electrical and Electronic Engineering Q2 355 / 970 63% 大类:Engineering 小类:Condensed Matter Physics Q2 185 / 443 58% 大类:Engineering 小类:Surfaces, Coatings and Films Q2 60 / 132 54% 大类:Engineering 小类:Atomic and Molecular Physics, and Optics Q2 108 / 232 53% 大类:Engineering 小类:Electronic, Optical and Magnetic Materials Q2 147 / 305 51%WOS期刊JCR分区
WOS分区等级:3区| 按JIF指标学科分区 | 收录子集 | JIF分区 | JIF排名 | JIF百分位 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 226/366 |
|
| 学科:NANOSCIENCE & NANOTECHNOLOGY | SCIE | Q4 | 120/147 |
|
| 学科:PHYSICS, APPLIED | SCIE | Q3 | 134/187 |
|
| 按JCI指标学科分区 | 收录子集 | JCI分区 | JCI排名 | JCI百分位 |
| 学科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 270/366 |
|
| 学科:NANOSCIENCE & NANOTECHNOLOGY | SCIE | Q4 | 115/147 |
|
| 学科:PHYSICS, APPLIED | SCIE | Q3 | 139/187 |
|
期刊分区表预警名单
2025年03月发布的2025版:不在预警名单中2024年02月发布的2024版:不在预警名单中
2023年01月发布的2023版:不在预警名单中
2021年12月发布的2021版:不在预警名单中
2020年12月发布的2020版:不在预警名单中
中科院2025年3月升级版
点击查看中国科学院期刊分区趋势图| 大类学科 | 小类学科 | Top期刊 | 综述期刊 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| 工程技术 3区 |
| 否 | 否 |
中科院2023年12月旧的升级版
| 大类学科 | 小类学科 | Top期刊 | 综述期刊 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| 工程技术 4区 |
| 否 | 否 |